Job Description

The Principal Packaging engineer will be an individual contributor and should be able to perform package design related to flash memory products

- As a IC packaging engineer, you will work in the Packaging R&D; group on package deign, modeling and simulation across semiconductor packaging, flash memory product, and host levels.
- In this position, you will be responsible for influencing package and product design and advancing the technology of semiconductor packaging generally.
- Scope is to address all design aspects of packaging technology and associated material and process interactions.
- In this position , you will be responsible to design / drive innovative projects , cost saving projects, technology scoping for future Gen technology and products.
- Coordinate package assessments for memory design needs.
- Provide solution paths for development.
- Package fitment and roadmap definition of packages for products across market segments.
- Focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects and higher power.
- Candidate will be responsible for the modeling and simulation of mechanical responses of the IC package and flash products using analytical and computational tools.
- Responsible for maintaining package roadmaps and budgets for the product lines supported.
- This position will interface with package & product design, electrical and physical characterization, lab testing, failure analysis, assembly R&D; and other process teams.
- Interacting with internal engineering departments, vendors and customers to develop high performance leadership package
- Ability to daily multi-tasking in different projects, manage and meet tight deadlines of packaging deliverables as a part of multidisciplinary team as well as excellent communication and interpersonal skills required.
- Knowledge of Package signal integrity and power integrity principles would be good. Knowledge of EMI, HFSS, HSPICE is a plus.

Hands-on with oscilloscopes, network analyzers and spectrum analyzers also a plus

Skills in AutoCAD , Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques are good.

Qualifications

Designation : Principle Engineer

Experience : 10 15 Years in semiconductor IC packaging industry

Preferred Industry : Semiconductor Manufacturing / PCBA Manufacturing

- B.Tech or M.Tech in mechanical / microelectronics / mechatronics / Thermal / electronics engineering
- Solid knowledge through academic coursework subjects
- Background in applied mechanics with emphasis on both analytical and computational methods.
- AutoCAD courses
- Broad knowledge of mechanical behaviours of various material types, such as ceramics and glass, polymers, and metals (e.g., solder).
- Demonstrated strong work ethic.
- Excellent communication and coordination skills, able to present the complex design structures in a clearly understandable narrative.
- Ideal candidate would have a broad knowledge of memory industry and trends.
- Working knowledge in hardware / systems integration.
- Prior program management experience managing multiple stakeholders.

Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development

12 hours ago