Position Overview:

We are seeking a highly skilled and experienced Package Architect to lead the design and optimization of package solutions for our advanced semiconductor products. As a key member of our engineering team, you will play a pivotal role in driving the development of innovative packaging technologies to meet the demands of our customers and industry standards.

Roles and Responsibilities:

As the Package Architect for Automotive SoC Products, you will have the following key responsibilities:
• Architecting Package Solutions:
• Lead the development of package architectures for next-gen automotive products, leveraging advanced packaging techniques such as 2.5D and 3D integration.
• Drive SOC-silicon die/chiplets co-optimization to achieve best-in-class performance, power efficiency, and reliability.
• Collaborative Workgroup Leadership:
• Lead the package design workgroup and foster collaboration across multiple stakeholder teams including ATTD, SoC, Platform, Electrical, Thermal/Mechanical, and others.
• Ensure alignment and synergy among different teams to achieve project objectives and milestones.
• Package Design Ownership:
• Take ownership of the entire package design process, including footprint, ballmap, and layout, ensuring adherence to project timelines and deliverables.
• Provide inputs and drive solutions during technical readiness reviews to ensure design readiness for tape-out.
• Issue Analysis and Debugging:
• Analyze failures and work closely with stakeholders to debug issues and provide effective solutions to address them.
• Utilize your expertise to troubleshoot complex technical challenges related to package design and integration.
• Mentorship and Leadership:
• Mentor and lead a team of design engineers, providing guidance and support to ensure package designs meet established guidelines and standards.
• Drive continuous improvement initiatives and foster a culture of innovation within the team.

Qualifications:

To excel in this role, you should possess the following qualifications:
• Educational Background: Master's Degree in Electrical Engineering with 15+ years of relevant industry experience or PhD in Electrical Engineering with 8-10 years of relevant experience.
• Expertise in Advanced Packaging Technologies: Demonstrated expertise in advanced silicon packaging technologies such as MCM, 2.5D, and 3D packaging technology.
• Package Design Experience: Proven experience with complete design cycle experience in package design and tape-out for at least 2 designs.
• Proficiency in Design Tools: Experience with package design tools such as Xpedition, ADP, Virtuoso, and other similar design tools.
• Design Guidelines Knowledge: Expertise with design guidelines and rules concerning various aspects like stackup, materials, routing, placement, and thermal/mechanical constraints.
• Innovative Thinking: Innovative thinker with the ability to propose and drive solutions to complex product definition challenges.
• Automotive Domain Experience: Experience in the automotive domain and PCB/system design will be considered an advantage.
• Effective Communication Skills: Ability to communicate effectively across multiple disciplines and domains, fostering collaboration and alignment among diverse teams.

Benefits:

We offer a competitive compensation package including salary, stock options, bonuses, health benefits, retirement plans, and vacation. Join our team and enjoy amazing benefits while making a significant impact in the automotive technology sector.